Information
Application:
It is used for the removal of inner dry film, outer dry film and ENIG selective dry film during PCB manufacturing, and in particular applicable to the r🐷emoval of dry film for fine circuit, and 👍applies to the film removal for IC substrate and MSAP process.
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Advantage introduction:
Free of caustic soda, free of impact on tin surface and solder mask ink;
Free of oxidation on copper surface and gold surface;
Film broken into small particles to prevent wrapping roller and blocking nozzle;
High film removal rate, more than 1x faster than NaOH;
Bath life can be extended more than 10X than NaOH;
Applicable to film removal for IC substrate and MSAP process.